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OWC’s Envoy Pro EX Named As CES Innovations 2014 Design and Engineering Award Honoree

PR_EnvoyProEXOther World Computing today announced that it has been named an International CES Innovations 2014 Design and Engineering Awards Honoree for the OWC Envoy Pro EX USB 3.0 Portable SSD Solution. Products entered in this prestigious program were judged by a preeminent panel of independent industrial designers, independent engineers and members of the trade media to honor outstanding design and engineering in cutting edge consumer electronics products across 29 product categories.

“We are proud that the Envoy Pro EX was singled out from such a prestigious field of electronics products, for its design, function and engineering,” said Larry O’Connor, founder and CEO of Other World Computing. “We look forward to exhibiting it along with our other top of the line computer upgrade and expansion products at CES 2014.”  

CES Innovations 2014 Design and Engineering entries were judged based on the following criteria:

• Engineering qualities, based on technical specs and materials used

• Aesthetic and design qualities

• Product use and user value

• Unique/novel features

• How product design and innovation directly compares to other products in the market place

The Envoy Pro EX will be displayed in The Venetian at the 2014 International CES, which runs January 7-10, 2014 in Las Vegas, Nevada. Honorees will also be displayed at CES Unveiled: The Official Media Event of the International CES from 4-7 p.m. on Sunday, Jan. 5 in South Seas Ballroom C at Mandalay Bay. The OWC line of computer upgrade and expansion products can be found at CES at Booth 30472, Jan. 7 through January 10, 2014.

About Innovations Design and Engineering Awards

The prestigious Innovations Design and Engineering Awards are sponsored by the Consumer Electronics Association (CEA), the producer of the International CES, the global gathering place for all who thrive on the business of consumer technology, and have been recognizing achievements in product design and engineering since 1976.

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  • Hey Larry when you all get the envoy external enclosure with thunderbolt , that’s when I will replace my orginal Mac SSD drive in my Macbook 13inch 2011 air with one of yours. If no thunderbolt then there is no reason for me to upgrade to 6gb speed since I cannot use the orginal drive at any faster speed then USB2 with the 2011 drive in you envoy.

    • Unfortunately – due to qualification requirements on bus-powered enclosures, we are not able to even offer bus-powered Envoy without a drive already inside. Also, Thunderbolt for external solutions would require a substantially larger enclosure design as well.

      The Apple drive in the 2011 MacBook Air is a relatively slow drive vs. our Aura Pro 6Gb/s for the 2011 and even vs. our 3Gb/s Aura pro models which are for 2010, but also 2011 compatible. There is a substantial internal capacity upgrade opportunity as well as performance for your Air.

      A thunderbolt to USB 3 adapter might be a practical way to get more performance from your existing Apple SSD via our Envoy enclosure post-upgrade, but there is currently no path for us to offer a bus powered enclosure that the existing Apple SSD blade can go into.

      Thank you for the feedback.

    • I think it doesn’t have Thunderbolt and USB3 instead because the data transfer is negligible between the two protocols. The big difference is when Thunderbolt2 comes down the pike.